激光划线产品技术参数一览表（单位：mm）
项目 等级Class 优级品 特级品（边缘磨加工) 有效尺寸Dimension 长Length≤300,宽Width≤120, 0.20≤厚度Thickness≤1.20 长宽公差 厚度Thickness≤0.63 +0.10 -0.05 +0.10 -0.05 0.63＜厚度Thickness≤0.76 +0.15 -0.05 0.76＜厚度Thickness≤1.0 +0.20 -0.10 厚度公差Thickness tolerance ±7%厚度,但不小于0.05mm ±7% of the thickness，and NLT 0.05mm 线与线间公差Tolerance between scribed line ±0.05 最小划线宽度Minimum scribing width 0.10 孔径Scribing hole diameter 圆孔直径0.15±0.02，孔中心间距0.17±0.02 The central distance of hole is 0.17±0.02 边缘到划线（孔中心）间公差 to scribed line (the middle of hole) 厚度Thickness≤0.63 +0.10 -0.05 ±0.05 0.63＜厚度Thickness≤0.76 +0.15 -0.05 ±0.05 0.76＜厚度Thickness≤1.0 +0.20 -0.10 ±0.05 孔公差 φ0.2~2.0 ±0.05 ±0.05 φ2.0~10.0 ±0.10 ±0.10 ＞φ10.0 ±0.15 ±0.15 孔中心间距公差 ±0.05 ±0.05 孔到孔及孔到边缘最小距离 ≥1.2倍基片厚度，且不小于2.0mm and NLT 2.0mm 通孔入口直径减出口直径 ≤8%基片厚度 翘曲度Camber ≤0.05/25.4(长边) 平行度/垂直度Parallel degree/vertical degree 0.3%最长边尺寸
Item
Fine
Excellent(edge whetted)
Length tolerance
Diameter of round hole is 0.15± 0.02;
Tolerance of edge
Hole tolerance
Center to center distance of Holes tolerance
Minimum distance of hole to hole and hole to edge
≥1.2 times thickness of the substrate,
Diameter between entry and exit sides of a hole
≤8% thickness of the substrate
≤0.05/25.4(longer side )
0.3% of the longest side
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