自动化一站式网上交易平台

1、 特点 Feature

1.1先进的封装工艺，封装材料满足UL94-V0

Advanced packaging technology, packaging materials meet UL94-V0   

1.2结构紧凑，体积小，节省空间

Compact structure, small size, space saving

1.3优越的高温高湿性能

Superior high temperature and high humidity performance

1.4强大的抑制高浪涌强电流能力

Strong ability to suppress high surge and high current

1.5 SMD料盘包装，适用于无铅回流焊/波峰焊自动贴装

SMD tray packaging, suitable for lead-free reflow soldering/wave soldering automatic placement

1.6符合RoSH ，REACH ，H.F无卤

Comply with RoSH, REACH，H.F

1.7管理体系认证：ISO9001:2015质量管理体系

               ISO9001:2015 Quality Management System

               ISO14001:2015环境管理体系

               ISO14001:2015 Environmental Management System

               IAFT16949汽车行业质量管理体系

               IAFT16949 Automotive Quality Management System

2、应用 Application

2.1 LED circuit protection        LED电路保护

2.2 Industrial equipment       工业设备

2.3 Communication equipment  通讯设备

2.4 Automotive Electronics     汽车电子